S-Cubed

For over 20 years, S-Cubed’s solutions to semiconductor photolithography processing for wafer level chip scale packaging (WLCSP) have evolved to provide more reliability and versatility at a lower cost, than any other spin track solution in the industry. Our equipment reliably bakes, coats, and develops millions of wafers every year. We use modern equipment such as camera based measurement and sensing systems, multiple interchangeable wafer size capability as a standard and many more. Contact us at http://www.s-cubed.com/

Products Carried: High Volume Semiconductor Photoresist Processing For WLCSP – The SCENE 12, Flexi, PRC 6625, Scene 8 Wafer Level Chip Scale Processing (WLCSP), WEE - Water Edge Exposure, MicroFab, Fotofab, Flexi Basic, Cyclone